The surface tension of a promising lead-free solder Au-Bi-Sn alloys was investigated both by the sessile-drop method and calculation. Experimental measurements were carried out for two cross-sections with the constant gold to bismuth ration of 1:1 and 1:2. For all the investigated compositions, decrease of the surface tension is observed with increasing temperature. Meanwhile, the surface tension values were also calculated based on Butler's equation, with using the newest research on thermodynamics data of Au-Bi-Sn ternary system. Compared with the experimental results, a good agreement was obtained.