Growth kinetics of interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal

• 作者: Yonggang Fan Cong Wang
• 来源期刊: 材料科学技术（英文版）
• 年，卷（期）: 2021,（33）
• 页码范围: 69-74
• 页数: 6页
• 语种: 英文

摘要

In the present investigation,the growth kinetics of interfacial reaction layer products between cubic boron nitride(CBN)and Cu-Sn-Ti filler metal has been thoroughly investigated.Detailed morphological and compositional features of respective compounds have been demonstrated for a wide brazing tem-perature ranging from 1153 K to 1223 K.It is found that within 30 minutes brazing holding time,the reaction layer growth is largely determined by the population of TiN via effective Ti diffusion with an activation energy of 223.51 kJ/mol,leading to parabolic growth patterns.It is further revealed that TiN grows both in axial and length dimensions,which eventually extends to the forefront and covers the reaction layer.