Microstructure, wetting property of Sn-Ag-Cu-Bi-xCe solder and IMC growth at solder/Cu interface during thermal cycling

• 作者: Yuan Wang Xiu-Chen Zhao Ying Liu Yong Wang Dong-Mei Li
• 来源期刊: 稀有金属（英文版）
• 年，卷（期）: 2021,（3）
• 所属期刊栏目: ORIGINAL ARTICLES
• 页码范围: 714-719
• 页数: 6页
• 语种: 英文
• DOI: 10.1007/s12598-015-0526-1

摘要

The effects of adding small amounts of cerium (Ce) to Sn-3.3Ag-0.2Cu-4.7Bi solder on microstructure,wettability characteristic,interfacial morphology and the growth of interfacial intermetallic compound (IMC) during thermal cycling were investigated by optical microscopy (OM),scanning electron microscopy (SEM) and solder-ability tester.It is found that the β-Sn phase,Ag3Sn phase and Cu6Sn5 phase in the solder are refined and the wetting force increases.Ce is an active element;it more easily accumulates at the solder/flux interface in the molten state,which decreases the interfacial surface energy and reduces the driving force for IMC formation on Cu substrate;therefore,the thickness of IMC at the solder/Cu interface decreases when appropriate Ce was added into the solder.Moreover,the Ce-containing solders have lower growth rate of interfacial IMC than solders without Ce during the thermal cycling between-55 and 125 ℃.When the Ce content is 0.03 wt％ in the Sn-3.3Ag-0.2Cu-4.7Bi solder,the solder has the best wettability and the minimum growth rate of interracial IMC layer.